# HongRuiXing (Hubei) Electronics Co.,Ltd. | FR4 Flash Memory Ic Substrate,1mil Flash Memory Ic Substrate,Multiple Wafers Nand CSP Substrate, Storage IC Package Substrate Pcb,Horexs IC Package Substrate Pcb,IC Package Substrate Horexs, Goldfinger Fingerprint Recognition PCB,FR4 Fingerprint Recognition PCB,0.15mm Fingerprint Recognition PCB, ## summary > Manufacturer, Brands: HOREXS,HRX, HOREXS is a famous Chinese IC substrate manufacturer which professionally produce 2-6L substrate (buildup types) exceeded 10 years., Established in 2010, Employees: 100~200, Annual sales: 50million-100million, Export ratio: 80% - 90%, Primary markets: Worldwide. ## Company Information * [Company Profile](https://www.horexspcb.com/aboutus.html): Overview, history, teams and core capabilities. * [Factory & Manufacturing](https://www.horexspcb.com/factory.html): Production capacity, OEM/ODM capabilities, and R&D strength. * [Quality Control](https://www.horexspcb.com/quality.html): ISO certifications, quality standards, and compliance. * [Contact Us](https://www.horexspcb.com/contactus.html): Global offices, inquiries, and support channels. ## Product Category * [BGA Substrate](https://www.horexspcb.com/supplier-413382-bga-substrate): Keywords: 0.15mm LED PCB Board,Complex FR4 LED PCB Board,UL Led Lamp Pcb. * [IC Package Substrate](https://www.horexspcb.com/supplier-413383-ic-package-substrate): Keywords: Ultra Thin Bga Circuit Board,Horexs Bga Circuit Board,Bga Circuit Board With Wire Bonding. * [Sip Package Substrate](https://www.horexspcb.com/supplier-3404157-sip-package-substrate): Keywords: 0.8mm RAM PCB Board,Gold Plated RAM PCB,Horexs PCB. * [FCCSP Package Substrate](https://www.horexspcb.com/supplier-3404171-fccsp-package-substrate): Keywords: Antenna PCB For Handwriting,2 Layer 0.1mm Antenna PCB,0.1mm PCB Lead Free. * [Sensors Substrate](https://www.horexspcb.com/supplier-3404172-sensors-substrate): Keywords: Fingerprint Recognition PCB For Intelligent Lock,UL Fingerprint Recognition PCB,Fingerprint Recognition PCB Board Fabrication. * [RF Module Substrate](https://www.horexspcb.com/supplier-3404195-rf-module-substrate): Keywords: 0.1mm PCB For IC Card,0.1mm Fingerprint Recognition PCB,2 Layer Fingerprint Recognition PCB. * [Memory Substrate](https://www.horexspcb.com/supplier-413384-memory-substrate): Keywords: FR4 SD Card PCB,Horexs SD Card PCB,0.15mm Multilayer Pcb. * [MEMS Substrate](https://www.horexspcb.com/supplier-413387-mems-substrate): Keywords: MEMS PCB Project Board,Ultra thin MEMS PCB,Horexs MEMS PCB. * [IoT Substrate](https://www.horexspcb.com/supplier-413391-iot-substrate): Keywords: 0.2mm Camera Module PCB,Immersion Gold Camera Module PCB,0.2mm Module PCB Board. * [Other Ultrathin Substrate](https://www.horexspcb.com/supplier-413381-other-ultrathin-substrate): Keywords: Memory Card Fr4 Circuit Board,0.15mm Fr4 Circuit Board,ROHS Fr4 Circuit Board. * [Ultrathin Rigid PCB](https://www.horexspcb.com/supplier-413386-ultrathin-rigid-pcb): Keywords: Gold Plating Ultrathin Rigid PCB,0.2mm Ultrathin Rigid PCB,Customized Ultrathin Rigid PCB. * [Medical Equipment PCB](https://www.horexspcb.com/supplier-413393-medical-equipment-pcb): Keywords: Ultrathin Medical Equipment PCB,0.35mm Medical Equipment PCB,Customized Medical Equipment PCB. ## Featured Products * [FBGA/PBGA/LGA Package Semiconductor Substrate Manufacture](https://www.horexspcb.com/sale-36266296-fbga-pbga-lga-package-semiconductor-substrate-manufacture.html): Keywords: ENIG Semiconductor Substrate,BGA package Semiconductor Substrate,UL semiconductor substrate manufacturers. * [FCBGA/BGA package substrate manufacture](https://www.horexspcb.com/sale-37423497-fcbga-bga-package-substrate-manufacture.html) * [Storage IC Package Substrate Pcb](https://www.horexspcb.com/quality-13449147-storage-ic-package-substrate-pcb): Keywords: Storage IC Package Substrate Pcb,Horexs IC Package Substrate Pcb,IC Package Substrate Horexs. * [4layer BT material Sip Packaging Substrate Semiconductor package](https://www.horexspcb.com/sale-13688704-4layer-bt-material-sip-packaging-substrate-semiconductor-package.html): Keywords: MSAP Sip Packaging Substrate,BT Sip Packaging Substrate,4layer CSP Semiconductor Substrate. * [NAND/FLASH Memory Ic packaging Substrate](https://www.horexspcb.com/sale-13688631-nand-flash-memory-ic-packaging-substrate.html): Keywords: FR4 Flash Memory Ic Substrate,1mil Flash Memory Ic Substrate,Multiple Wafers Nand CSP Substrate. * [FBGA/PBGA/LGA Package Semiconductor Substrate manufacture](https://www.horexspcb.com/sale-13688895-fbga-pbga-lga-package-semiconductor-substrate-manufacture.html): Keywords: MEMS Semiconductor Substrate Boards,CMOS Semiconductor Substrate Boards,1mil MEMS Memory Substrate. * [BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness](https://www.horexspcb.com/sale-13905648-bt-enepig-4-layer-sip-package-substrate-0-24mm-finished-thickness.html): Keywords: 4 Layer Sip Package Substrate,BT ENEPIG Sip Package Substrate,0.29mm Finished Package Chip Substrate. * [RF Module substrate impedance control 4L BT material soft gold](https://www.horexspcb.com/sale-13180447-rf-module-substrate-impedance-control-4l-bt-material-soft-gold.html): Keywords: Goldfinger Fingerprint Recognition PCB,FR4 Fingerprint Recognition PCB,0.15mm Fingerprint Recognition PCB. * [RF/mmwave module substrate manufacture](https://www.horexspcb.com/sale-13374437-rf-mmwave-module-substrate-manufacture.html): Keywords: BT Pcb Printed Circuit Board,2 Layer Pcb Printed Circuit Board,BT Black Pcb Circuit Board. * [microelectronics package substrate manufacture](https://www.horexspcb.com/sale-13374439-microelectronics-package-substrate-manufacture.html): Keywords: Black Soldermask LED PCB Board,Black Soldermask led lamp pcb,LED PCB Board With total Pad. ## 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